Minister for Railways, Information and Broadcasting, Electronics and Information Technology Ashwini Vaishnav briefing the media on cabinet in New Delhi on August 12, 2025
| Photo Credit: Shiv Kumar Pushpakar
The Union Cabinet on Tuesday (August 12, 2025) approved four projects under the India Semiconductor Mission (ISM). Two of the projects will be in Bhubaneswar in Odisha, and one each will be in Punjab and Andhra Pradesh. The cumulative value of the projects is ₹4,594 crore.
This brings the number of projects under the ₹76,000-crore mission, which provides financial support to semiconductor units, to ten.
The first chip from one of the previous six units — some are competing, so it’s not clear which — will be rolled out in three months.
The firms behind the projects are SiCSem (which will make a silicon carbide integrated facility in Info Valley, Bhubaneswar); Continental Device India Private Limited, which will expand its existing “discrete semiconductor manufacturing facility” in Mohali; 3D Glass Solutions Inc., which will set up a “vertically integrated advanced packaging and embedded glass substrate unit” in Bhubaneswar; and Advanced System in Package (ASIP) Technologies, which will set up a semiconductor unit in Andhra Pradesh, with the location yet to be chosen.
Union Minister of Electronics and Information Technology Ashwini Vaishnaw said that having the capacity to work on silicon carbide technology, an “evolving” field, was strategically important for India. “IIT Bhubaneswar already has a ₹45 crore investment in a silicon carbide research unit, and the results have been very good,” he added.
Published – August 12, 2025 03:27 pm IST
