Ultrasonic vibrations hold key to precision drilling in brittle materials, IIT Bombay study finds
Drilling microscopic holes in brittle materials like glass and ceramics, essential for smartphones, medical devices, and microfluidic chips, has long posed a challenge for manufacturers. Conventional methods often crack the material or fail when debris clogs narrow, deep holes. Researchers at the Indian Institute of Technology (IIT) Bombay have demonstrated how ultrasonic-assisted electrochemical discharge machining (UA-ECDM)…
