Qualcomm chip design India – Artifex.News https://artifex.news Stay Connected. Stay Informed. Sat, 07 Feb 2026 15:08:00 +0000 en-US hourly 1 https://wordpress.org/?v=6.9.1 https://artifex.news/wp-content/uploads/2023/08/cropped-Artifex-Round-32x32.png Qualcomm chip design India – Artifex.News https://artifex.news 32 32 Global firms are now trusting India for their most advanced semiconductor work: Minister Ashwini Vaishnaw https://artifex.news/article70604464-ece/ Sat, 07 Feb 2026 15:08:00 +0000 https://artifex.news/article70604464-ece/ Read More “Global firms are now trusting India for their most advanced semiconductor work: Minister Ashwini Vaishnaw” »

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“This breakthrough placed India firmly in the league of countries working on cutting-edge chip design, alongside companies such as AMD that have already showcased such capabilities,” Union Minister Ashwini Vaishnaw said during the Texas Instruments new product research and development inaugural event, in Bengaluru on February 7, 2026. Photo: Special Arrangement

India is making significant progress in the semiconductor manufacturing design, although a new industry, the entire ecosystem is getting ready in the country, said Ashwini Vaishnaw, Union Minister for Electronics and IT in Bengaluru on Saturday (February 7, 2026).

Commenting on the progress the country has been making in the sector, Minister Vaishnaw, while releasing the new 2-nanometre Qualcomm chip in Bengaluru, said the developments marked a change in India’s earlier role as a software service provider and a back-office to an end-to-end semiconductor product design and development hub.

“Today, we unveiled the two-nanometre wafer, two-nanometre chip at Qualcomm. This is part of a series of developments where companies are now designing in the country to develop the industry,” the Minister said, adding that the announcement of the 2-nanometre chip tape cut by Qualcomm also indicated how global firms were now trusting India with their most advanced semiconductor work.

Each chip carried supercomputing power, with about 20–30 billion transistors per die (silicon). That kind of density allowed a GPU and a CPU to sit within a small chip, Mr. Vaishnaw elaborated, showing the wafer to the media. “The final module can function as an AI computer across devices: desktops and cameras to routers, automobiles, trains, aircraft, networking equipment and industrial systems etc supporting edge computing and AI-led high performance computing applications,” he said.

Later speaking at a press conference, the Minister said, this breakthrough placed India firmly in the league of countries working on cutting-edge chip design, alongside companies such as AMD that have already showcased such capabilities.

“Data centres are going to be a major growth journey in the coming years. So far, we have committed $70 billion dollars in investments, with recent announcements the figure will be $90 billion,” the Minister said. Semiconductors were a long-term national project which has a scope for a multi-decade journey and based on industry discussions, he said the investments could further rise in the coming years and may exceed $200 billion as AI adoption accelerates, he indicated.

On talent preparedness, Mr. Vaishnaw said, under the Semicon 1.0 mission, the government had set a target of training 85,000 semiconductor professionals over 10 years. In four years, some 67,000 semiconductor engineers were trained. Students in some 315 universities and colleges have access to electronic automation tools and were actively involved in designing chips, he added.



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Qualcomm announces a major needle movement in chip design in India https://artifex.news/article70603269-ece/ Sat, 07 Feb 2026 08:29:00 +0000 https://artifex.news/article70603269-ece/ Read More “Qualcomm announces a major needle movement in chip design in India” »

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Qualcomm’s presence in India spans over 20 years of continuous investment, during which the company has built one of its largest engineering development capabilities outside the United States. File.
| Photo Credit: Reuters

Qualcomm Technologies, Inc.on Saturday (February 7, 2026) announced the tape-out of its 2nm semiconductor design, marking a significant moment in advanced chip design amid India’s rapidly expanding semiconductor ecosystem.

According to the company, this reflects the strength of Qualcomm’s Global engineering capabilities collaboratively with engineering development centers in Bengaluru, Chennai, and Hyderabad, representing one of the company’s most advanced and skilled development footprints globally, as well as its largest engineering workforce outside the United States.

The milestone underscores India’s emergence as a critical hub for cutting-edge semiconductor development and showcases Qualcomm’s long-term investment in building and accelerating the nation’s semiconductor landscape, it claimed.

The milestone was showcased at the Qualcomm Bengaluru facility during the visit of Ashwini Vaishnaw, Union Minister of Railways, Information & Broadcasting, and Electronics & IT.

“India is increasingly at the center of how advanced semiconductor technologies are being designed for the future. Seeing Qualcomm’s work here, its engineering strength, deep design capabilities, and long-standing commitment to India, is truly impressive. Milestones like this demonstrate how far India’s design ecosystem has come and align strongly with our vision of building a globally competitive semiconductor industry,” said Mr. Vaishnaw.

Amitesh Kumar Sinha, Additional Secretary, Ministry of Electronics & IT and CEO, India Semiconductor Mission said, “India’s Semiconductor Mission is progressing with strong momentum, supported by a strengthening design ecosystem and sustained industry participation. Investments in advanced engineering and R&D capabilities are important to building long-term semiconductor capacity in the country. Qualcomm’s long-term commitment to India reflects the growing depth of India’s semiconductor design ecosystem and contributes to India’s broader ambition of becoming a globally competitive hub for semiconductor innovation.”

“This achievement is a testament to the strength and depth of our engineering teams in India” said Srini Maddali, Senior Vice President, Engineering, Qualcomm India Private Limited. “Working closely with global program and architecture teams on advanced semiconductor design requires the very best talent, and our India teams consistently deliver at a global standard. We collaborate closely with multiple stakeholders in India and around the world, who are driving ambitious digital transformation journeys. India continues to be integral part to our global engineering roadmap, and this milestone reflects the exceptional capability and impact of our engineering workforce here”.

Qalcomm’s R&D centres in India were contributing across multiple layers of system design, from architecture to implementation, software platforms, and use‑case optimization,” said Shashi Reddy, Senior Vice President, Engineering, Qualcomm.

Qualcomm’s presence in India spans over 20 years of continuous investment, during which the company has built one of its largest engineering development capabilities outside the United States.



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